Vol. 2020, Issue DPC, 2020April 17, 2024 EDT
Heterogeneous System-in-Package (HSIP) Using Fan-Out Wafer-Level Packaging (FOWLP)
Heterogeneous System-in-Package (HSIP) Using Fan-Out Wafer-Level Packaging (FOWLP)
Woychik, Charles, Justin Borski, and Robert Nead. 2024. “Heterogeneous System-in-Package (HSIP) Using Fan-Out Wafer-Level Packaging (FOWLP).” IMAPSource Proceedings 2020 (DPC): 1226–48. https://doi.org/10.4071/001c.116682.