Vol. 2020, Issue DPC, 2020April 17, 2024 EDT
Polymer Enabled Ultra-Thin Package Solutions for Heterogeneous, Package-in-Package and Embedded ICs
Polymer Enabled Ultra-Thin Package Solutions for Heterogeneous, Package-in-Package and Embedded ICs
Hackler, Doug. 2024. “Polymer Enabled Ultra-Thin Package Solutions for Heterogeneous, Package-in-Package and Embedded ICs.” IMAPSource Proceedings 2020 (DPC): 1208–25. https://doi.org/10.4071/001c.116670.