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ISSN 2380-4505
Device Packaging Conference Presentations
Vol. 2020, Issue DPC, 2020April 16, 2024 EDT

Permanent Bonding Adhesive: A Novel Permanent Bonding Material

Trevor Stanley, Reihaneh Sejoubsari, Xiao Liu,
Permanent bonding materialAdhesive bondingPolymeric intermediate layer
https://doi.org/10.4071/001c.116669
IMAPSource Conference Papers
Stanley, Trevor, Reihaneh Sejoubsari, and Xiao Liu. 2024. “Permanent Bonding Adhesive: A Novel Permanent Bonding Material.” IMAPSource Proceedings 2020 (DPC): 1167–84. https:/​/​doi.org/​10.4071/​001c.116669.

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