Collective D2W Hybrid Bonding for 3D SIC and Heterogeneous Integration

Thomas Uhrmann; Jürgen Burggraf; Mariana Pires

doi:10.4071/001c.116668

Uhrmann, Thomas, Jürgen Burggraf, and Mariana Pires. 2024. “Collective D2W Hybrid Bonding for 3D SIC and Heterogeneous Integration.” IMAPSource Proceedings 2020 (DPC): 1145–66. https://doi.org/10.4071/001c.116668.

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Collective D2W Hybrid Bonding for 3D SIC and Heterogeneous Integration

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