Vol. 2020, Issue DPC, 2020April 16, 2024 EDT
Paths Towards Ultra High-Density Interconnect 3D Systems: Contribution of Wafer Geometry for Achieving Sub 200NM Wafer-to-Wafer Bonding Overlay
Paths Towards Ultra High-Density Interconnect 3D Systems: Contribution of Wafer Geometry for Achieving Sub 200NM Wafer-to-Wafer Bonding Overlay
Iacovo, Serena, Joeri Devos, Alain Phommahaxay, Andy Miller, Eric Beyne, Thomas Uhrmann, and Andreas Fehkuhrer. 2024. “Paths Towards Ultra High-Density Interconnect 3D Systems: Contribution of Wafer Geometry for Achieving Sub 200NM Wafer-to-Wafer Bonding Overlay.” IMAPSource Proceedings 2020 (DPC): 1118–44. https://doi.org/10.4071/001c.116667.