Vol. 2020, Issue DPC, 2020April 16, 2024 EDT
Paths Towards Ultra High-Density Interconnect 3D Systems: Contribution of Wafer Geometry for Achieving Sub 200NM Wafer-to-Wafer Bonding Overlay
Paths Towards Ultra High-Density Interconnect 3D Systems: Contribution of Wafer Geometry for Achieving Sub 200NM Wafer-to-Wafer Bonding Overlay
Serena Iacovo, Joeri Devos, Alain Phommahaxay, Andy Miller, Eric Beyne, Thomas Uhrmann, Andreas Fehkuhrer,
Iacovo, Serena, Joeri Devos, Alain Phommahaxay, Andy Miller, Eric Beyne, Thomas Uhrmann, and Andreas Fehkuhrer. 2024. “Paths Towards Ultra High-Density Interconnect 3D Systems: Contribution of Wafer Geometry for Achieving Sub 200NM Wafer-to-Wafer Bonding Overlay.” IMAPSource Proceedings 2020 (DPC): 1118–44.