Skip to main content
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
EMPC Conference Proceedings (IMAPS Europe)
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
Device Packaging Conference Presentations
Vol. 2020, Issue DPC, 2020
April 16, 2024 EDT
Copper Wire Ready for Automotive AEC Requirements?
William Crockett
,
Automotive Device Packaging
Copper Wire Reliability
AEC
•
https://doi.org/10.4071/001c.116643
IMAPSource Conference Papers
Crockett, William. 2024. “Copper Wire Ready for Automotive AEC Requirements?”
IMAPSource Proceedings
2020 (DPC): 200–218.
https://doi.org/10.4071/001c.116643
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats