This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search
  • LinkedIn (opens in a new tab)
  • RSS feed (opens a modal with a link to feed)

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:37401/feed
ISSN 2380-4505
Device Packaging Conference Presentations
Vol. 2020, Issue DPC, 2020April 16, 2024 EDT

Trends in FOWLP: 600mm Panel Level for 6-Sided Die Protection with M-Series

Jacinta Aman Lim,
600mm Panel Level ProcessingWafer Level PackagingFan-out
https://doi.org/10.4071/001c.116641
IMAPSource Conference Papers
Lim, Jacinta Aman. 2024. “Trends in FOWLP: 600mm Panel Level for 6-Sided Die Protection with M-Series.” IMAPSource Proceedings 2020 (DPC): 128–44. https:/​/​doi.org/​10.4071/​001c.116641.

View more stats

Powered by Scholastica, the modern academic journal management system