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Device Packaging Conference Presentations
Vol. 2020, Issue DPC, 2020April 16, 2024 EDT

Interconnect Transitions and the Challenges Ahead

E. Jan Vardaman,
interconnect transitionsadvanced packagingwafer level packaging
https://doi.org/10.4071/001c.116631
IMAPSource Conference Papers
Vardaman, E. Jan. 2024. “Interconnect Transitions and the Challenges Ahead.” IMAPSource Proceedings 2020 (DPC): 585–608. https:/​/​doi.org/​10.4071/​001c.116631.
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