Carbon-Based Thermal Interface Materials for High-Power Device Packaging

Kevin Brenner; Paul Xu; Jesus Alejandro Bolivar

doi:10.4071/001c.116544

Brenner, Kevin, Paul Xu, and Jesus Alejandro Bolivar. 2024. “Carbon-Based Thermal Interface Materials for High-Power Device Packaging.” IMAPSource Proceedings 2021 (DPC): 1348–1348. https://doi.org/10.4071/001c.116544.

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Carbon-Based Thermal Interface Materials for High-Power Device Packaging

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