Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:24211/feed
Device Packaging Conference Presentations
Vol. 2021, Issue DPC, 2021April 12, 2024 EDT

Analysis of Advanced Polymer Semiconductor Packaging Materials by Atomic Scale Simulation

Andrea R. Browning, Simon D. Elliott, H. Shaun Kwak, Mohammad Atif Faiz Afzal, Anand Chandrasekaran, Tsuguo Morisato, Alexander Goldberg, Mathew D. Halls,
advanced packagingpolymersatomic scale simulation
https://doi.org/10.4071/001c.116543
IMAPSource Conference Papers
Browning, Andrea R., Simon D. Elliott, H. Shaun Kwak, Mohammad Atif Faiz Afzal, Anand Chandrasekaran, Tsuguo Morisato, Alexander Goldberg, and Mathew D. Halls. 2024. “Analysis of Advanced Polymer Semiconductor Packaging Materials by Atomic Scale Simulation.” IMAPSource Proceedings 2021 (DPC): 1333–37. https:/​/​doi.org/​10.4071/​001c.116543.
Save article as...▾

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Powered by Scholastica, the modern academic journal management system