Vol. 2021, Issue DPC, 2021April 12, 2024 EDT
Analysis of Advanced Polymer Semiconductor Packaging Materials by Atomic Scale Simulation
Analysis of Advanced Polymer Semiconductor Packaging Materials by Atomic Scale Simulation
Browning, Andrea R., Simon D. Elliott, H. Shaun Kwak, Mohammad Atif Faiz Afzal, Anand Chandrasekaran, Tsuguo Morisato, Alexander Goldberg, and Mathew D. Halls. 2024. “Analysis of Advanced Polymer Semiconductor Packaging Materials by Atomic Scale Simulation.” IMAPSource Proceedings 2021 (DPC): 1333–37. https://doi.org/10.4071/001c.116543.