Investigation of Low Temperature Bonding Process based on Cu/Ni/In Solid Liquid Interdiffusion

Adil Shehzad; Steffen Bickel; Iuliana Panchenko; Jürgen M. Wolf; Wolfram Steller; Benedikt Wolfram; Maksym Myndyk

doi:10.4071/001c.116539

Shehzad, Adil, Steffen Bickel, Iuliana Panchenko, Jürgen M. Wolf, Wolfram Steller, Benedikt Wolfram, and Maksym Myndyk. 2024. “Investigation of Low Temperature Bonding Process Based on Cu/Ni/In Solid Liquid Interdiffusion.” IMAPSource Proceedings 2021 (DPC): 1313–1313. https://doi.org/10.4071/001c.116539.

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Investigation of Low Temperature Bonding Process based on Cu/Ni/In Solid Liquid Interdiffusion

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