Thiol-based, Thermally-Conductive Adhesives for High Power Electronics

Benjamin Lund; Carlos Barrios; Mahmoud Hosseini; Xun Han; Ali Aliev; Ray Baughman; Walter Voit

doi:10.4071/001c.116537

Lund, Benjamin, Carlos Barrios, Mahmoud Hosseini, Xun Han, Ali Aliev, Ray Baughman, and Walter Voit. 2024. “Thiol-Based, Thermally-Conductive Adhesives for High Power Electronics.” IMAPSource Proceedings 2021 (DPC): 1349–54. https://doi.org/10.4071/001c.116537.

View more stats

Thiol-based, Thermally-Conductive Adhesives for High Power Electronics

This website uses cookies