Vol. 2021, Issue DPC, 2021April 12, 2024 EDT
Liquid Metal Embedded Elastomers (LMEEs) as an Emerging Material Architecture for TIMs in Semiconductor Packaging
Liquid Metal Embedded Elastomers (LMEEs) as an Emerging Material Architecture for TIMs in Semiconductor Packaging
Kazem, Navid. 2024. “Liquid Metal Embedded Elastomers (LMEEs) as an Emerging Material Architecture for TIMs in Semiconductor Packaging.” IMAPSource Proceedings 2021 (DPC): 1300–1333. https://doi.org/10.4071/001c.116535.