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Device Packaging Conference Presentations
Vol. 2021, Issue DPC, 2021April 11, 2024 EDT

Heterogeneous Integration: Opportunities and Challenges

E. Jan Vardaman,
heterogeneous integrationsilicon nodeson package integrationsilicon interposers
https://doi.org/10.4071/001c.116503
IMAPSource Conference Papers
Vardaman, E. Jan. 2024. “Heterogeneous Integration: Opportunities and Challenges.” IMAPSource Proceedings 2021 (DPC): 156–72. https:/​/​doi.org/​10.4071/​001c.116503.
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