Vol. 2021, Issue DPC, 2021April 11, 2024 EDT
Electromigration Study of a Novel Cu Stack-via Interconnect for Advanced High-Density Fan-Out Packaging
Electromigration Study of a Novel Cu Stack-via Interconnect for Advanced High-Density Fan-Out Packaging
Shao, Kuan-Ju, Min-Yan Tsai, Chien-Lung Liang, Chin-Li Kao, Gao-Tian Lin, and Kwang-Lung Lin. 2024. “Electromigration Study of a Novel Cu Stack-via Interconnect for Advanced High-Density Fan-Out Packaging.” IMAPSource Proceedings 2021 (DPC): 699–718. https://doi.org/10.4071/001c.116492.