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Device Packaging Conference Presentations
Vol. 2021, Issue DPC, 2021April 11, 2024 EDT

Effect of Silicon BEOL Presence on Solder Fatigue Life During Board-Level Thermal Cycling of WLCSP

Rameen Hadizadeh, Yaoyu Pang, Anuj Patel,
silicon BEOL presencesolder fatigue lifeboard-level thermal cyclingWLCSP
https://doi.org/10.4071/001c.116487
IMAPSource Conference Papers
Hadizadeh, Rameen, Yaoyu Pang, and Anuj Patel. 2024. “Effect of Silicon BEOL Presence on Solder Fatigue Life During Board-Level Thermal Cycling of WLCSP.” IMAPSource Proceedings 2021 (DPC): 719–45. https:/​/​doi.org/​10.4071/​001c.116487.
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