ISSN 2380-4505
Vol. 2021, Issue DPC, 2021April 11, 2024 EDT
Advancements of Temporary Bond and Debond: Creating Photonic Debonding Methods and Materials for Wafer-Level Packaging
Advancements of Temporary Bond and Debond: Creating Photonic Debonding Methods and Materials for Wafer-Level Packaging
Prenger, Luke. 2024. “Advancements of Temporary Bond and Debond: Creating Photonic Debonding Methods and Materials for Wafer-Level Packaging.” IMAPSource Proceedings 2021 (DPC): 878–901. https://doi.org/10.4071/001c.116484.