A Novel Photosensitive Permanent Bonding Material for Polymer/Metal Hybrid Bonding

Baron Huang; Duo Tsai; Xiao Liu; Rama Puligadda

doi:10.4071/001c.116483

Huang, Baron, Duo Tsai, Xiao Liu, and Rama Puligadda. 2024. “A Novel Photosensitive Permanent Bonding Material for Polymer/Metal Hybrid Bonding.” IMAPSource Proceedings 2021 (DPC): 858–76. https://doi.org/10.4071/001c.116483.

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A Novel Photosensitive Permanent Bonding Material for Polymer/Metal Hybrid Bonding

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