ISSN 2380-4505
Vol. 2021, Issue DPC, 2021April 10, 2024 EDT
Die-first and RDL-first FOWLP Processing for Flexible Hybrid Electronics
Die-first and RDL-first FOWLP Processing for Flexible Hybrid Electronics
Fukushima, Takafumi (Tak), Yuki Susumago, Noriyuki Takahashi, Hisashi Kino, and Tetsu Tanaka. 2024. “Die-First and RDL-First FOWLP Processing for Flexible Hybrid Electronics.” IMAPSource Proceedings 2021 (DPC): 820–41. https://doi.org/10.4071/001c.116407.
