2-High Stacked Heterogeneous System-in-Package (HSIP) Modules Using Solder Assembly

Charles Woychik; Robert Mundella; Larry Black; Justin Borski; Robert Nead

doi:10.4071/001c.116405

Woychik, Charles, Robert Mundella, Larry Black, Justin Borski, and Robert Nead. 2024. “2-High Stacked Heterogeneous System-in-Package (HSIP) Modules Using Solder Assembly.” IMAPSource Proceedings 2021 (DPC): 746–62. https://doi.org/10.4071/001c.116405.

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2-High Stacked Heterogeneous System-in-Package (HSIP) Modules Using Solder Assembly

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