Vol. 2021, Issue DPC, 2021April 10, 2024 EDT
Using Deca’s Adaptive PatterningTM to Win the Chiplet Integration Race with Siemens EDA and ASE
Using Deca’s Adaptive PatterningTM to Win the Chiplet Integration Race with Siemens EDA and ASE
Gabriel, Robin, Jan Kellar, Keith Felton, Ian Gabbitas, John Hunt, and Lihong Cao. 2024. “Using Deca’s Adaptive PatterningTM to Win the Chiplet Integration Race with Siemens EDA and ASE.” IMAPSource Proceedings 2021 (DPC): 763–87. https://doi.org/10.4071/001c.116401.