Vol. 2021, Issue DPC, 2021April 10, 2024 EDT
Die-to-Die Interconnect Design and Simulation for 2.3D Organic Interposer Package
Die-to-Die Interconnect Design and Simulation for 2.3D Organic Interposer Package
Muir, Cindy, Bernd Waidhas, Abdallah Bacha, Carlton Hanna, and Beth Keser. 2024. “Die-to-Die Interconnect Design and Simulation for 2.3D Organic Interposer Package.” IMAPSource Proceedings 2021 (DPC): 892–919. https://doi.org/10.4071/001c.116400.