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Device Packaging Conference Presentations
Vol. 2021, Issue DPC, 2021April 10, 2024 EDT

Challenges for Achieving Automotive Grade 1/0 Reliability in FCBGA and fcCSP Packages

Knowlton Olmstead,
flip chip Chip Scale Packaging (fcCSP)Flip Chip ball grid array (FCBGAautomotivethermal cycling (TC)high temperature storage (HTS)
https://doi.org/10.4071/001c.116399
IMAPSource Conference Papers
Olmstead, Knowlton. 2024. “Challenges for Achieving Automotive Grade 1/0 Reliability in FCBGA and fcCSP Packages.” IMAPSource Proceedings 2021 (DPC): 2139–60. https:/​/​doi.org/​10.4071/​001c.116399.
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