Vol. 2021, Issue DPC, 2021April 10, 2024 EDT
Solderless Anisotropic Conductive Film for Compact Package Designs, High-Frequency Signal Integrity, Robust Connections
Solderless Anisotropic Conductive Film for Compact Package Designs, High-Frequency Signal Integrity, Robust Connections
Wu, Jerry. 2024. “Solderless Anisotropic Conductive Film for Compact Package Designs, High-Frequency Signal Integrity, Robust Connections.” IMAPSource Proceedings 2021 (DPC): 1098–1125. https://doi.org/10.4071/001c.116395.