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ISSN 2380-4505
Device Packaging Conference Presentations
Vol. 2021, Issue DPC, 2021April 10, 2024 EDT

Investigation of Carbon Fiber TIM Gap Pad for Enabling Next Generation Automotive High-Power Systems

Jerry Wu,
Thermal ManagementPower ModuleTIMCarbon FiberThermal ResistancePackaging
https://doi.org/10.4071/001c.116390
IMAPSource Conference Papers
Wu, Jerry. 2024. “Investigation of Carbon Fiber TIM Gap Pad for Enabling Next Generation Automotive High-Power Systems.” IMAPSource Proceedings 2021 (DPC): 1016–38. https:/​/​doi.org/​10.4071/​001c.116390.

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