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Device Packaging Conference Presentations
Vol. 2021, Issue DPC, 2021April 09, 2024 EDT

Emerging Process and Assembly Challenges in Electronics Manufacturing

Glenn Farris,
heterogeneous integrationcost effective solutionsinterconnect methodologieselectronics manufacturingemerging process
https://doi.org/10.4071/001c.116345
IMAPSource Conference Papers
Farris, Glenn. 2024. “Emerging Process and Assembly Challenges in Electronics Manufacturing.” IMAPSource Proceedings 2021 (DPC): 1185–1201. https:/​/​doi.org/​10.4071/​001c.116345.
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