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Device Packaging Conference Presentations
Vol. 2021, Issue DPC, 2021
April 09, 2024 EDT
Advanced Packaging Dielectric for 5G
Pawel Miskiewicz
,
Greg Larbig
,
Noboru Satake
,
Jens Pradella
,
Frank Meyer
,
Matthias Koch
,
advanced packaging
5G
dielectrics
•
https://doi.org/10.4071/001c.116340
IMAPSource Conference Papers
Miskiewicz, Pawel, Greg Larbig, Noboru Satake, Jens Pradella, Frank Meyer, and Matthias Koch. 2024. “Advanced Packaging Dielectric for 5G.”
IMAPSource Proceedings
2021 (DPC): 1165–84.
https://doi.org/10.4071/001c.116340
.
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