Vol. 2021, Issue DPC, 2021April 09, 2024 EDT
Thermal Performance Enhancement of Dual Side Molding SiP Module for 5G Application
Thermal Performance Enhancement of Dual Side Molding SiP Module for 5G Application
Huang, Hung-Hsien, Wei-Hong Lai, Dao-Long Chen, David Tarng, and CP Hung. 2024. “Thermal Performance Enhancement of Dual Side Molding SiP Module for 5G Application.” IMAPSource Proceedings 2021 (DPC): 1202–15.