Vol. 2021, Issue DPC, 2021April 09, 2024 EDT
A Low Tg Bonding Material for Use with Wafer-Level System-in-Package (WLSiP) and Fan-Out Wafer-Level Packaging (FOWLP) Processes
A Low Tg Bonding Material for Use with Wafer-Level System-in-Package (WLSiP) and Fan-Out Wafer-Level Packaging (FOWLP) Processes
Southard, Arthur, Rachel Cartaya, Dongshun Bai, and John Massey. 2024. “A Low Tg Bonding Material for Use with Wafer-Level System-in-Package (WLSiP) and Fan-Out Wafer-Level Packaging (FOWLP) Processes.” IMAPSource Proceedings 2021 (DPC): 431–54. https://doi.org/10.4071/001c.116302.