Vol. 2021, Issue DPC, 2021April 08, 2024 EDT
Magnetic Core Inductor Embedded in Laminates for 3D Integrations
Magnetic Core Inductor Embedded in Laminates for 3D Integrations
Wu, Yanze, I-Chen Yeng, and Hongbin Yu. 2024. “Magnetic Core Inductor Embedded in Laminates for 3D Integrations.” IMAPSource Proceedings 2021 (DPC): 408–30. https://doi.org/10.4071/001c.116301.