3D Packaging from Edge to the Datacenter:  An Imperative for the Next Decade

Vaibhav Trivedi

doi:10.4071/001c.116300

Trivedi, Vaibhav. 2024. “3D Packaging from Edge to the Datacenter: An Imperative for the Next Decade.” IMAPSource Proceedings 2021 (DPC): 1355–98. https://doi.org/10.4071/001c.116300.

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3D Packaging from Edge to the Datacenter: An Imperative for the Next Decade

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