Innovative Package on Package Solution: M-Series Fan-Out (mPoP)

Byung Cheol Kim

doi:10.4071/001c.116289

Kim, Byung Cheol. 2024. “Innovative Package on Package Solution: M-Series Fan-Out (mPoP).” IMAPSource Proceedings 2021 (DPC): 532–43. https://doi.org/10.4071/001c.116289.

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