Vol. 2021, Issue DPC, 2021April 08, 2024 EDT
Package Assembly Design Kits - What are They and How Can They Benefit the Packaging Community — Chiplets and 3D Stacking. An EDA perspective of Heterogenous Integration
Package Assembly Design Kits - What are They and How Can They Benefit the Packaging Community — Chiplets and 3D Stacking. An EDA perspective of Heterogenous Integration
Park, John. 2024. “Package Assembly Design Kits - What Are They and How Can They Benefit the Packaging Community — Chiplets and 3D Stacking. An EDA Perspective of Heterogenous Integration.” IMAPSource Proceedings 2021 (DPC): 544–63. https://doi.org/10.4071/001c.116287.