Vol. 2021, Issue DPC, 2021April 08, 2024 EDT
System-Level Design Assembly and Management for 3D-IC Architectures
System-Level Design Assembly and Management for 3D-IC Architectures
Jackson, Brian. 2024. “System-Level Design Assembly and Management for 3D-IC Architectures.” IMAPSource Proceedings 2021 (DPC): 589–609. https://doi.org/10.4071/001c.116286.