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Device Packaging Conference Presentations
Vol. 2021, Issue DPC, 2021April 08, 2024 EDT

System-Level Design Assembly and Management for 3D-IC Architectures

Brian Jackson,
system level desgin assembly3D-IC architecturesmulti-chiplet packaging technologies
https://doi.org/10.4071/001c.116286
IMAPSource Conference Papers
Jackson, Brian. 2024. “System-Level Design Assembly and Management for 3D-IC Architectures.” IMAPSource Proceedings 2021 (DPC): 589–609. https:/​/​doi.org/​10.4071/​001c.116286.
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