All Articles tagged thin film packaging

• Device Packaging Conference Presentations
  January 01, 2013 EDT
  A design tool fully adapted to the development of the thin film packaging process used for MEMS devices
  Souchon FredericGervais Anne-CharlotteThouy LaurentSaint-Patrice DamienPornin Jean louis

  MEMS Wafer Level Packaging is required for mass production of MEMS devices: wafer to wafer bonding is usually the current solution, however thin film encapsulation becomes a promising alternative method...

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• Device Packaging Conference Presentations
  January 01, 2012 EDT
  Thin Film Packaging for Vacuum MEMS Encapsulation: A Study on Outgassing Phenomenon
  D. Saint-PatriceJ. L. PorninB. SavorninG. RodriguezS. DanthonP. L. CharvetP. NicolasS. NicolasS. Fanget

  Most of the time, MEMS devices require hermetic encapsulation for protection against atmosphere, moisture, particles and standard back-end manufacturing technologies. In the last few years, Wafer Level Packaging (WLP) is...

  Abstract
• Device Packaging Conference Presentations
  January 01, 2010 EDT
  Thin Film Packaging Reinforcement for Overmolded MEMS
  Gillot CharlotteJean-Louis PorninChristophe BillardEmannuelle LagouteMihel PellatGuy ParatNicolas Sillon

  Thin Film packaging (TFP) is now well known at CEA/LETI and mainly used as a protection for MEMS against degradation which can occur during back end processes: TFP is strong...

  Abstract