All Articles tagged media
- Device Packaging Conference Presentations
April 16, 2024 EDT Permanent wafer bonding in advanced microelectronic and microelectromechanical systems platforms includes direct, anodic, solder, eutectic, thermocompression, direct metal-to-metal, ultrasonic, and adhesive bonding.
- Symposium Proceedings
May 01, 2023 EDT Mobile devices, including smart phones and tablets, are increasing in complexity and require ever greater amounts of memory storage.
- Symposium Proceedings
January 01, 2013 EDT The intermediate bus architecture (IBA) is currently the most popular power system architecture in computing and telecommunications equipment. It typically consists of a +48 V system power distribution bus that...
- Ceramics Conference Papers
September 01, 2011 EDT Usually, resonating cantilevers come from silicon technology and are generally activated with pure bending mode. In this work, we suggest to combine high sensitive cantilever structure with full self-actuated piezoelectric...