All Articles tagged Laser sintering
EMPC Conference Proceedings (IMAPS Europe)
March 07, 2024 EDT Cu complex inks offer a facile and cost-effective alternative to commercial nanoparticle inks for printed electronics application.
Symposium Proceedings
October 01, 2019 EDT Laser sintering of interconnects printed on flexible substrate with silver nanoparticle ink is studied as an alternative to convection oven sintering. Interconnects of 80 μm and 250 μm line width...
Symposium Proceedings
October 01, 2017 EDT This paper reveals a study on Selective Laser Melting (SLM) as an alternative technology for producing power electronic substrates, and shows the possibility of producing a stable interface between alumina...
Ceramics Conference Papers
May 01, 2016 EDT The ceramic thick-film technology allows the build-up of miniaturised and robust integrated multilayer-circuits and sensors by means of sequential screen-printing and firing of different functional materials. However, the manufacturing of...