Adhesion Copper/Molding Compound: Modeling and Characterization

Marco Rovitto; Samuele Zalaffi; Carlo Passagrilli; Claudio Maria Villa; Luca Andena; Stefano Mariani

doi:10.4071/001c.94822

Rovitto, Marco, Samuele Zalaffi, Carlo Passagrilli, Claudio Maria Villa, Luca Andena, and Stefano Mariani. 2024. “Adhesion Copper/Molding Compound: Modeling and Characterization.” IMAPSource Proceedings 2023 (EMPC): 306–11. https://doi.org/10.4071/001c.94822.

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