Vol. 2023, Issue EMPC, 2023March 07, 2024 EDT
Adhesion Copper/Molding Compound: Modeling and Characterization
Adhesion Copper/Molding Compound: Modeling and Characterization
Rovitto, Marco, Samuele Zalaffi, Carlo Passagrilli, Claudio Maria Villa, Luca Andena, and Stefano Mariani. 2024. “Adhesion Copper/Molding Compound: Modeling and Characterization.” IMAPSource Proceedings 2023 (EMPC): 306–11. https://doi.org/10.4071/001c.94822.