Influence of Thermally Aged Underfill on Flip-Chip Packages

Kevin Cox; Ghassan Abu-Hamdeh; Matt Borden

doi:10.4071/001c.94683

Cox, Kevin, Ghassan Abu-Hamdeh, and Matt Borden. 2024. “Influence of Thermally Aged Underfill on Flip-Chip Packages.” IMAPSource Proceedings 2023 (EMPC): 66–71. https://doi.org/10.4071/001c.94683.

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Influence of Thermally Aged Underfill on Flip-Chip Packages

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