Vol. 2023, Issue EMPC, 2023March 05, 2024 EDT
Influence of Thermally Aged Underfill on Flip-Chip Packages
Influence of Thermally Aged Underfill on Flip-Chip Packages
Cox, Kevin, Ghassan Abu-Hamdeh, and Matt Borden. 2024. “Influence of Thermally Aged Underfill on Flip-Chip Packages.” IMAPSource Proceedings 2023 (EMPC): 66–71. https://doi.org/10.4071/001c.94683.