Hybrid Bond Interconnect and Advanced Packaging Solutions

Thomas Workman; Dominik Suwito; Laura Mirkarimi; Gill Fountain; Guilian Gao; Jeremy Theil; Bongsub Lee; Cyprian Uzoh; Oliver Zhao; KM Bang

doi:10.4071/001c.90683

Workman, Thomas, Dominik Suwito, Laura Mirkarimi, Gill Fountain, Guilian Gao, Jeremy Theil, Bongsub Lee, Cyprian Uzoh, Oliver Zhao, and KM Bang. 2023. “Hybrid Bond Interconnect and Advanced Packaging Solutions.” IMAPSource Proceedings 2023 (DPC): 794–812. https://doi.org/10.4071/001c.90683.

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Hybrid Bond Interconnect and Advanced Packaging Solutions

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