Smart Ultrasonic Welding – A Versatile Interconnection Technology for Power Electronics Packaging

Matthias Hunstig; Sebastian Holtkämper; Lars Helmich; Michael Brökelmann

doi:10.4071/2380-4491.2021.HiTEC.000112

Loading [Contrib]/a11y/accessibility-menu.js

Hunstig, Matthias, Sebastian Holtkämper, Lars Helmich, and Michael Brökelmann. 2021. “Smart Ultrasonic Welding – A Versatile Interconnection Technology for Power Electronics Packaging.” IMAPSource Proceedings 2021 (HiTEC, CICMT, Power): 112–17. https://doi.org/10.4071/2380-4491.2021.HiTEC.000112.

View more stats