Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT
Optimization of Al Heavy Wire Bonds Bond profile in WBG Power Module Design
Optimization of Al Heavy Wire Bonds Bond profile in WBG Power Module Design
Utkarsh Mehrotra, Adam J. Morgan, Douglas C. Hopkins,
Mehrotra, Utkarsh, Adam J. Morgan, and Douglas C. Hopkins. 2021. “Optimization of Al Heavy Wire Bonds Bond Profile in WBG Power Module Design.” IMAPSource Proceedings 2021 (IMAPS Symposium): 260–64. https://doi.org/10.4071/1085-8024-2021.1.000260.