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General
Vol. 2021, Issue 1, 2021
October 01, 2021 EDT
Optimization of Al Heavy Wire Bonds Bond profile in WBG Power Module Design
Utkarsh Mehrotra
,
Adam J. Morgan
,
Douglas C. Hopkins
,
Wire Bonding
Interconnects
Stray Parasitics
Current carrying capacity
•
https://doi.org/10.4071/1085-8024-2021.1.000260
IMAPSource Conference Papers
Mehrotra, Utkarsh, Adam J. Morgan, and Douglas C. Hopkins. 2021. “Optimization of Al Heavy Wire Bonds Bond Profile in WBG Power Module Design.”
IMAPSource Proceedings
2021 (1): 260–64.
https://doi.org/10.4071/1085-8024-2021.1.000260
.
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