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Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT

Optimization of Al Heavy Wire Bonds Bond profile in WBG Power Module Design

Utkarsh Mehrotra, Adam J. Morgan, Douglas C. Hopkins,
Wire BondingInterconnectsStray ParasiticsCurrent carrying capacity
https://doi.org/10.4071/1085-8024-2021.1.000260
IMAPSource Conference Papers
Mehrotra, Utkarsh, Adam J. Morgan, and Douglas C. Hopkins. 2021. “Optimization of Al Heavy Wire Bonds Bond Profile in WBG Power Module Design.” IMAPSource Proceedings 2021 (IMAPS Symposium): 260–64. https:/​/​doi.org/​10.4071/​1085-8024-2021.1.000260.
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