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High Temperature Conference Papers
Vol. 2019, Issue HiTen, 2019July 01, 2019 EDT

Stackable SiC Embedded Ceramic Packages for High Voltage and High Temperature Power Electronics Applications

Hoang Linh Bach, Daniel Dirksen, Christoph Blechinger, Tobias Maximilian Endres, Christoph Friedrich Bayer, Andreas Schletz, Martin März,
Ceramic chip embeddingcost-effective and fast rapid prototypingmultilayer DBC substratessimple adaptable WBG packages
https://doi.org/10.4071/2380-4491.2019.HiTen.000028
IMAPSource Conference Papers
Bach, Hoang Linh, Daniel Dirksen, Christoph Blechinger, Tobias Maximilian Endres, Christoph Friedrich Bayer, Andreas Schletz, and Martin März. 2019. “Stackable SiC Embedded Ceramic Packages for High Voltage and High Temperature Power Electronics Applications.” IMAPSource Proceedings 2019 (HiTen): 28–33. https:/​/​doi.org/​10.4071/​2380-4491.2019.HiTen.000028.
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