Stackable SiC Embedded Ceramic Packages for High Voltage and High Temperature Power Electronics Applications

Hoang Linh Bach; Daniel Dirksen; Christoph Blechinger; Tobias Maximilian Endres; Christoph Friedrich Bayer; Andreas Schletz; Martin März

doi:10.4071/2380-4491.2019.HiTen.000028

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High Temperature Conference Papers

Vol. 2019, Issue HiTen, 2019

July 01, 2019 EDT

Stackable SiC Embedded Ceramic Packages for High Voltage and High Temperature Power Electronics Applications

Hoang Linh Bach, Daniel Dirksen, Christoph Blechinger, Tobias Maximilian Endres, Christoph Friedrich Bayer, Andreas Schletz, Martin März,

Ceramic chip embedding cost-effective and fast rapid prototyping multilayer DBC substrates simple adaptable WBG packages

• https://doi.org/10.4071/2380-4491.2019.HiTen.000028

IMAPSource Conference Papers

Bach, Hoang Linh, Daniel Dirksen, Christoph Blechinger, Tobias Maximilian Endres, Christoph Friedrich Bayer, Andreas Schletz, and Martin März. 2019. “Stackable SiC Embedded Ceramic Packages for High Voltage and High Temperature Power Electronics Applications.” IMAPSource Proceedings 2019 (HiTen): 28–33. https://doi.org/10.4071/2380-4491.2019.HiTen.000028.

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