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Device Packaging Conference Presentations
Vol. 2019, Issue DPC, 2019January 01, 2019 EDT

UV Projection Scanner Performance in Thick Resists for High Aspect Ratio Cu Pillars

William Vis, Fabian Benthaus, Habib Hichri, Markus Arendt,
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https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_TP1_063
IMAPSource Conference Papers
Vis, William, Fabian Benthaus, Habib Hichri, and Markus Arendt. 2019. “UV Projection Scanner Performance in Thick Resists for High Aspect Ratio Cu Pillars.” IMAPSource Proceedings 2019 (DPC): 314–37. https:/​/​doi.org/​10.4071/​2380-4491-2019-DPC-Presentation_TP1_063.
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