Loading [Contrib]/a11y/accessibility-menu.js
Skip to main content
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
EMPC Conference Proceedings (IMAPS Europe)
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
Device Packaging Conference Presentations
Vol. 2019, Issue DPC, 2019
January 01, 2019 EDT
Thinking in 3D - The New Architecture
Javi DeLaCruz
,
DBI
Direct Bond Interconnect
Hybrid Bonding
•
https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_WP1_070
IMAPSource Conference Papers
DeLaCruz, Javi. 2019. “Thinking in 3D - The New Architecture.”
IMAPSource Proceedings
2019 (DPC): 1–22.
https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_WP1_070
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats
