Electrografted insulator layer as copper diffusion barrier for TSV interposers

Vincent Mevellec; Dominique Suhr; Thomas Dequivre; Frédérique Raynal

doi:10.4071/2013DPC-wa14

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Mevellec, Vincent, Dominique Suhr, Thomas Dequivre, and Frédérique Raynal. 2013. “Electrografted Insulator Layer as Copper Diffusion Barrier for TSV Interposers.” IMAPSource Proceedings 2013 (DPC): 1051–84. https://doi.org/10.4071/2013DPC-wa14.

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