Vol. 2018, Issue HiTEC, 2018May 01, 2018 EDT
Conductive Fusion Technology Advanced Die Attach Materials for High Power Applications
Conductive Fusion Technology Advanced Die Attach Materials for High Power Applications
Maciej Patelka, Nicholas Krasco, Sho Ikeda, Toshiyuki Sato, Miguel Goni, Elbara Ziade, Aaron J. Schmidt,
Patelka, Maciej, Nicholas Krasco, Sho Ikeda, Toshiyuki Sato, Miguel Goni, Elbara Ziade, and Aaron J. Schmidt. 2018. “Conductive Fusion Technology Advanced Die Attach Materials for High Power Applications.” IMAPSource Proceedings 2018 (HiTEC): 51–55. https://doi.org/10.4071/2380-4491-2018-HiTEN-000051.
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