Vol. 2011, Issue DPC, 2011January 01, 2011 EDT
Laser Technology for Through-Silicon Via and Microvia Drilling in Silicon for 3D Packaging Applications
Laser Technology for Through-Silicon Via and Microvia Drilling in Silicon for 3D Packaging Applications
Andy Hooper, Daragh Finn, Shane Noel, Gregg Anderson, Jim O'Brien, Chi-Cheng Lin,
Hooper, Andy, Daragh Finn, Shane Noel, Gregg Anderson, Jim O’Brien, and Chi-Cheng Lin. 2011. “Laser Technology for Through-Silicon Via and Microvia Drilling in Silicon for 3D Packaging Applications.” IMAPSource Proceedings 2011 (DPC): 1515–34. https://doi.org/10.4071/2011DPC-wp11.