Vol. 2011, Issue HITEN, 2011January 01, 2011 EDT
Optimizing the performance of the Au-Si system for high temperature die attach applications
Optimizing the performance of the Au-Si system for high temperature die attach applications
M.F. Sousa, S. Riches, C. Johnston, P.S. Grant,
Sousa, M.F., S. Riches, C. Johnston, and P.S. Grant. 2011. “Optimizing the Performance of the Au-Si System for High Temperature Die Attach Applications.” IMAPSource Proceedings 2011 (HITEN): 68–76. https://doi.org/10.4071/HITEN-Paper5-MSousa.