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High Temperature Conference Papers
Vol. 2011, Issue HITEN, 2011
January 01, 2011 EDT
Optimizing the performance of the Au-Si system for high temperature die attach applications
M.F. Sousa
,
S. Riches
,
C. Johnston
,
P.S. Grant
,
Au-Si eutectic
die bonding
reliability
scanning acoustic microscopy
die shear
•
https://doi.org/10.4071/HITEN-Paper5-MSousa
IMAPSource Conference Papers
Sousa, M.F., S. Riches, C. Johnston, and P.S. Grant. 2011. “Optimizing the Performance of the Au-Si System for High Temperature Die Attach Applications.”
IMAPSource Proceedings
2011 (HITEN): 68–76.
https://doi.org/10.4071/HITEN-Paper5-MSousa
.
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