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Symposium Proceedings
Vol. 2010, Issue 1, 2010
January 01, 2010 EDT
The Role of Wafer Bonding in 3D Integration and Packaging
James Hermanowski
,
Greg George
,
Wafer Bonding
3D Integration
3D Packaging
3D-IC
via
BEOL
FEOL
•
https://doi.org/10.4071/isom-2010-WA1-Paper1
IMAPSource Conference Papers
Hermanowski, James, and Greg George. 2010. “The Role of Wafer Bonding in 3D Integration and Packaging.”
IMAPSource Proceedings
2010 (1): 355–60.
https://doi.org/10.4071/isom-2010-WA1-Paper1
.
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