The Role of Wafer Bonding in 3D Integration and Packaging

James Hermanowski; Greg George

doi:10.4071/isom-2010-WA1-Paper1

Loading [Contrib]/a11y/accessibility-menu.js

Hermanowski, James, and Greg George. 2010. “The Role of Wafer Bonding in 3D Integration and Packaging.” IMAPSource Proceedings 2010 (1): 355–60. https://doi.org/10.4071/isom-2010-WA1-Paper1.

View more stats