Vol. 2010, Issue 1, 2010January 01, 2010 EDT
The Role of Wafer Bonding in 3D Integration and Packaging
The Role of Wafer Bonding in 3D Integration and Packaging
Hermanowski, James, and Greg George. 2010. “The Role of Wafer Bonding in 3D Integration and Packaging.” IMAPSource Proceedings 2010 (1): 355–60. https://doi.org/10.4071/isom-2010-WA1-Paper1.
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