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Symposium Proceedings
Vol. 2010, Issue 1, 2010January 01, 2010 EDT

The Role of Wafer Bonding in 3D Integration and Packaging

James Hermanowski, Greg George,
Wafer Bonding3D Integration3D Packaging3D-ICviaBEOLFEOL
https://doi.org/10.4071/isom-2010-WA1-Paper1
IMAPSource Conference Papers
Hermanowski, James, and Greg George. 2010. “The Role of Wafer Bonding in 3D Integration and Packaging.” IMAPSource Proceedings 2010 (1): 355–60. https:/​/​doi.org/​10.4071/​isom-2010-WA1-Paper1.
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